On Tuesday, March 19, SK Hynix announced the commencement of mass production for its latest high-bandwidth memory (HBM) chips, designed to enhance artificial intelligence (AI) chipsets’ performance. The company is set to begin shipments to Nvidia, a leading customer and AI chip market leader, within the month. The newly produced chip, dubbed HBM3E, marks a significant advancement in the competitive memory chip industry. This announcement follows Micron Technology’s recent initiation of mass production for similar chips and Samsung Electronics’ development of the first 12-stack HBM3E chips in the sector.
SK Hynix, currently the world’s second-largest memory chip manufacturer, has established a dominant position in the HBM chip market, especially as the exclusive supplier of the HBM3 version to Nvidia, which commands an 80% share of the AI chip market. “With the successful mass production of HBM3E and our pioneering experience as the first provider of HBM3, we aim to reinforce our leadership in the AI memory domain,” stated SK Hynix.
The HBM3E chip promises a 10% improvement in heat dissipation and the capability to process up to 1.18 terabytes of data per second, showcasing significant technological advancements. Analysts have noted that SK Hynix’s HBM production capacity is fully booked for 2024, reflecting the surging demand for high-performance memory chips driven by the growing AI chipset market. “SK Hynix has solidified an absolute market position… and is anticipated to lead the expansion in high-end memory chips among its peers,” commented Kim Un-ho, an analyst at IBK Investment & Securities.
In related news, Nvidia unveiled its latest flagship AI chip, the B200, on Monday. The B200 is reported to be 30 times faster at specific tasks than its predecessor, underscoring Nvidia’s efforts to sustain its preeminence in the rapidly evolving AI industry.
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