India is set to establish its first national security semiconductor fabrication plant through a collaborative effort with the United States. This facility will focus on producing chips for military applications and next-generation telecommunications. The announcement followed discussions between Indian Prime Minister Narendra Modi and U.S. President Joe Biden, during their meeting in Wilmington. A joint fact sheet released after the talks described the semiconductor project as a significant development in U.S.-India relations.
This initiative marks the first semiconductor fabrication partnership between the two nations. It is seen as a milestone, comparable to the civil nuclear agreement between the U.S. and India. The fabrication plant aims to manufacture advanced semiconductors, including infrared, gallium nitride, and silicon carbide technologies, supporting national security and green energy applications.
The project will be supported by the India Semiconductor Mission and a strategic technology partnership involving Bharat Semi, 3rdiTech, and the U.S. Space Force. This facility is expected to enhance semiconductor supply chains and facilitate collaboration in research and development in chip manufacturing.
Additionally, the leaders emphasized the importance of building secure and resilient supply chains, including the establishment of GlobalFoundries’ Kolkata Power Center. They also highlighted efforts to strengthen cooperation in 5G deployment and next-generation telecommunications. This includes a $7 million investment from the U.S. Agency for International Development to expand workforce training initiatives in South Asia, in collaboration with Indian institutions.
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